Using this approach, we test three configurations for thermal contact between the heat sink and chip: Here, we use an empirical value of 10 W/(m 2 However, the accuracy of these computations is tied to the reliability of the heat transfer coefficient used to define the convective cooling boundary condition. This enables us to make rapid computations. Approach 1: Solid Parts and a Convective Cooling Boundary Conditionįor the first approach, we only model solid parts and use a convective cooling boundary condition on the heat sink boundaries instead of computing the flow velocity, pressure, and temperature of the air channel. Next, let’s look at the two different approaches for solving this model, starting with the more computationally efficient approach. We can estimate the cooling capacity of the heat sink and predict the temperature of the electronic component by solving the model equations. The model enables us to solve for the thermal balance between the various components and to find the thermal contact between the chip and the heat sink when dealing with a thermally thick layer. A combination of conduction and convection transports the thermal energy in the cooling air, while conduction transfers thermal energy in the electronic component and heat sink. There, convection is the main form of thermal energy transport. Model geometry of the heat sink (gray) and electronic chip (purple).Īir flows from the inlet (where the temperature is set) through the channel to the outlet. This is distributed throughout the chip volume.
![convective cooling comsol 5.3 convective cooling comsol 5.3](https://cdn.comsol.com/release/53/heat-transfer-module/heat-sink.ru_RU.png)
As for the electronic component, it dissipates the equivalent of 5 W of heat. The heat sink is mounted within a channel that has a rectangular cross section. In this case, the model consists of an electronic chip and aluminum heat sink.
![convective cooling comsol 5.3 convective cooling comsol 5.3](https://cdn.comsol.com/release/53/heat-transfer-module/serendipity-element-options.png)
These parts, which are available as of version 5.3, make it easier to include a heat sink in a model geometry.įor more details, check out the Heat Transfer Module Release Highlights page. To create the model, we use the heat sink geometry parts available in the Part Library in the Heat Transfer Module, an add-on product to COMSOL Multiphysics.
![convective cooling comsol 5.3 convective cooling comsol 5.3](https://cdn.comsol.com/release/53/heat-transfer-module/external-temp.png)
Simulating Electronic Chip Cooling with COMSOL Multiphysics®įor our example, we model an electronic chip with a heat sink that is cooled by the surrounding fluid (air). Let’s discuss two of these approaches using the simple example of electronic chip cooling. Due to the flexibility of the software, we can approach the analysis in multiple ways. To analyze the cooling capacity of a heat sink, we can turn to the heat transfer modeling capabilities of COMSOL Multiphysics. Licensed under CC BY 2.0, via Flickr Creative Commons. This can impair the performance of these devices and even reduce their lifespans.Ī heat sink on a motherboard. As electronic devices become more powerful, they often generate more heat. Heat sinks have become more important with advancing technology.
#CONVECTIVE COOLING COMSOL 5.3 SOFTWARE#
We also discuss new features in the COMSOL Multiphysics® software that make it easier to set up heat sink geometries.ĭesigning Improved Heat Sinks for Electronic DevicesĪ frequent topic on the COMSOL Blog, heat sinks dissipate excess heat in electronic devices.
![convective cooling comsol 5.3 convective cooling comsol 5.3](https://priatherm.com/wp-content/uploads/2018/12/Picture4-300x239.png)
In this blog post, we compare two modeling approaches for analyzing electronic chip cooling. The modeling approach we use will affect the accuracy of the results and the efficiency of the simulation. By modeling heat transfer in these systems, we can calculate the temperature of the electronic components. When designing heat sinks, it’s important to accurately measure their cooling capacity.